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Fispal | June 3 - 6, 2014

Date: Jun 3-6, 2014

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Selig invites you to explore our innovative induction seals and closure liners at Fispal Tecnologia in São Paulo, Brazil starting June 3rd.  We will be highlighting many new applications from around the globe using our wide range of sealing solutions for the food, beverage, pharmaceutical, neutraceutical, agricultural chemical, dry beverage and cosmetic industries. On display will be our innovative easy-open ½ moon tab liner solutions such as Lift 'n' Peel™ and Top Tab™, as well as our extensive print capabilities. Learn from Selig’s experts on how our products improve today's packaging and share with us your current packaging challenges. We look forward to seeing you.

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Selig Group Stand/Booth Location H232
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Booth Location
Stand H232

www.fispaltecnologia.com.br

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